SUMMARY:
Our client is seeking a Lead Embedded Hardware Engineer / Hardware Lead to design and develop a highly miniaturized, high-performance avionics hardware platform. We are specifically looking for a senior engineer who has personally owned PCB design through to miniaturised production and is comfortable being the final technical authority on the hardware. You will own the full hardware lifecycle from schematic design and PCB layout through to prototyping, testing, and mass production.
You will be responsible for developing:
- The AeroNode processing hub (STM32-based flight computation system)
- The H1 headset electronics (wearable biometric and audio DSP system)
- High-density, safety-critical embedded PCB systems for aviation applications
POSITION INFO:
Required Experience & Skills 5-7+ years in embedded hardware and PCB design Strong experience with high-density, multi-layer PCB layout Proven ability in high-speed digital design and signal integrity Strong knowledge of STM32 microcontroller architecture Experience with EMI-sensitive designs (GPS, magnetometers, RF systems) Hands-on hardware debugging capability Experience with wearable or rigid-flex PCB design Demonstrated experience owning PCB development from concept, design, prototyping, validation, and miniaturised production Ability to act as the final technical authority for hardware design decisions Experience leading hardware development projects and mentoring junior engineers Advantageous (Bonus) Experience Drone or aviation hardware experience (Pixhawk, CubePilot, FMUv6x) Avionics, aerospace, or safety-critical embedded systems Experience with MRAM, eMMC, or high-reliability storage systems Familiarity with EKF-based navigation or flight control systems Key Responsibilities End-to-end PCB design using Altium Designer or KiCad Design of multi-layer, high-density embedded avionics hardware Integration of sensors and modules including IMUs, barometers, magnetometers, GNSS, and wireless communication systems High-speed interface design (SPI, I2C, USB, SDIO) with strong signal integrity control EMI\/EMC mitigation, particularly for GPS and magnetometer performance Design of rigid-flex PCBs for wearable electronics Collaboration with mechanical engineers on vibration, thermal, and enclosure design Support prototyping, debugging, and validation using lab equipment (oscilloscopes, logic analysers) Manage DFM\/DFA and transition from prototype to production Provide technical leadership and final sign-off on hardware architecture, design reviews, and production readiness Salary Market Related How to apply: 1. Follow the link to our job seekers ' page- 2. Search for the job title. 3. Click apply to submit your CV.
